ECT’s ZIP™ Z0 RF Spring Probe for Semiconductor Test Exceeds Customer Expectations

ZIP probes built from HyperCoreâ„¢ base material provides superior performance in high volume production

Everett Charles Technologies (ECT) successfully won a head-to-head evaluation of ZIP probes with the HyperCore™ material option in a high volume production environment at a large Chinese OSAT. The Z0 probes reached 450k insertions more than doubling the life of the competitor’s spring probe while exceeding first pass yield expectations.

ZIP is one of several semiconductor test probe families offered by ECT. For this evaluation the ZIP Z0-040RHJ probe was deployed in a multi-site test set-up for a 14L, 0.4mm pitch QFN package. The application was a RF transceiver. Testing was performed at ambient and hot (85°C) conditions. With its 1.5mm test height Z0 is an excellent choice for RF devices requiring low insertion loss (40GHz @ -1dB) and low inductance (0.55nH).

ECT’s patented ZIP probes feature a number of innovative design features that provide superior contact capability. ZIP probes have a large internal contact area resulting in low contact resistance, superior bandwidth and excellent conductance. ZIP probes are built from HyperCore™ and present a new level of accuracy, scalability and performance. The proprietary non-plated, homogenous probe material possesses properties that prevent oxidation, ensuring premium performance throughout high volume production cycles. With a hardness rating of 600 Knoop; ZIP has excellent wear characteristics, is effective for contacting hard DUT surfaces and withstands abrasive cleaning.

Tony DeRosa, Senior Product Manager explains: “Customers are continuously requiring lower cost per insertion. ECT’s ZIP™ probes meet this challenge by bringing value to customers through competitive pricing, high reliability and excellent electrical performance. Our RF simulation and validation capabilities further expands the cost-of-test advantage by providing a high level of confidence that Z0 will meet or exceed critical RF test requirements.”

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