ECT’s ZIP™ Probe for Semiconductor Test Exceeds Customer Expectations

ZIP probes built from HyperCoreâ„¢ base material proved superior performance in high volume production

Everett Charles Technologies (ECT) successfully passed a two month evaluation of ZIP probes using the HyperCore material option in a high volume production environment at a large OSAT in Singapore. The ZIP probe exceeded the critical first pass yield expectations and beat the target for a 500 k insertions life time by over 20%.

ZIP is one of several semiconductor test probe families offered by ECT. For this evaluation the ZIP probe was deployed in a quad-site test set-up for a 250 BGA package with 0.8 mm pitch for an Ethernet/MoCA (Multimedia over Coax Alliance) end application. The test was done at ambient and hot (85°C) conditions.

ECT’s patented ZIP probes feature a number of innovative design attributes that provide superior contact capability. ZIP probes have a large internal contact area resulting in low contact resistance, superior bandwidth and excellent conductance. ZIP probes built from HyperCore present a new level of accuracy, scalability and performance. The proprietary non-plated, homogenous probe material possesses properties that prevent oxidation, ensuring premium performance throughout high volume production cycles. With 600 Knoop hardness, it is inert to common wear related to contacting tough surfaces and abrasive cleaning.

Tony DeRosa, Senior Product Manager explains: “Customers are continuously requiring lower cost per insertion. ECT’s ZIP™ probes meet this challenge by bringing value to customers through competitive pricing, high reliability and excellent electrical performance. Last summer ECT released the HyperCore material option to the entire ZIP product line. HyperCore adds an advanced material option to expand the cost of test advantage.”

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