ECT ZIP® series probes feature a number of innovative designs that provide for superior contact capable of fitting your application needs.

Utilizing ECT’s patented flat technology, ZIP semiconductor spring probes present a new level of accuracy, scalability, and performance. While conventional round technology restricts longer travel and can have its reliability undermined by its small contact area, ZIP possesses a large internal contact area, resulting in low contact resistance, superior bandwidth, and excellent high current behavior.